byv29, byv29f, byv29b, ug8gt, ugf8gt, ugb8gt series vishay semiconductors formerly general semiconductor document number 88557 www.vishay.com 03-jul-02 1 ultrafast rectifier reverse voltage 300 to 400v forward current 8.0a reverse recovery time 35ns 0.08 (2.032) 0.24 (6.096) 0.42 (10.66) 0.63 (17.02) 0.12 (3.05) 0.33 (8.38) mounting pad layout to-263ab 0.380 (9.65) 0.411 (10.45) 0.320 (8.13) 0.360 (9.14) 0.591 (15.00) 0.624 (15.85) 1 2 0.245 (6.22) min k 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) k 0.160 (4.06) 0.190 (4.83) 0.045 (1.14) 0.055 (1.40) 0.021 (0.53) 0.014 (0.36) 0.110 (2.79) 0.140 (3.56) 0.090 (2.29) 0.110 (2.79) 0.047 (1.19) 0.055 (1.40) pin 1 pin 2 k - heatsink 0-0.01 (0-0.254) 0.060 (1.52) 0.405 (10.27) 0.383 (9.72) 0.191 (4.85) 0.171 (4.35) 0.600 (15.5) 0.580 (14.5) 0.560 (14.22) 0.530 (13.46) 0.037 (0.94) 0.027 (0.69) 0.140 (3.56) 0.130 (3.30) 0.350 (8.89) 0.330 (8.38) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.131 (3.39) 0.122 (3.08) 0.110 (2.80) 0.100 (2.54) 0.022 (0.55) 0.014 (0.36) 0.205 (5.20) 0.195 (4.95) 12 pin dia. dia. pin 1 pin 2 0.676 (17.2) 0.646 (16.4) ito-220ac (byv29f, ugf8 series) to-220ac (byv29, ug8 series) dimensions in inches and (millimeters) to-263ab (byv29b, ugb8 series) 0.154 (3.91) 0.148 (3.74) dia. 0.113 (2.87) 0.103 (2.62) 0.185 (4.70) 0.175 (4.44) 0.055 (1.39) 0.045 (1.14) 0.145 (3.68) 0.135 (3.43) 0.350 (8.89) 0.330 (8.38) 0.160 (4.06) 0.140 (3.56) 0.037 (0.94) 0.027 (0.68) 0.205 (5.20) 0.195 (4.95) 0.560 (14.22) 0.530 (13.46) 0.022 (0.56) 0.014 (0.36) 0.110 (2.79) 0.100 (2.54) 12 1.148 (29.16) 1.118 (28.40) 0.105 (2.67) 0.095 (2.41) 0.410 (10.41) 0.390 (9.91) 0.635 (16.13) 0.625 (15.87) 0.603 (15.32) 0.573 (14.55) pin 0.415 (10.54) max. pin 1 pin 2 case 0.370 (9.40) 0.360 (9.14) features ?plastic package has underwriters laboratories flammability classification 94v-0 ?ideally suited for freewheeling diode power factor correction applications ?soft recovery characteristics ?excellent high temperature switching ?optimized to reduce switching losses ?high temperature soldering in accordance with cecc 802 / reflow guaranteed ?glass passivated chip junction mechanical data case: jedec to-220ac, ito-220ac & to-263ab molded plastic body terminals: plated leads, solderable per mil-std-750, method 2026 polarity: as marked mounting position: any mounting torque: 5 in-lbs maximum weight: 0.08 oz., 2.24 g
byv29, byv29f, byv29b, ug8gt, ugf8gt, ugb8gt series vishay semiconductors formerly general semiconductor www.vishay.com document number 88557 2 03-jul-02 maximum ratings (t c = 25? unless otherwise noted) ug8ft ug8gt parameter symbol byv29-300 byv29-400 unit maximum repetitive peak reverse voltage v rrm 300 400 v maximum working reverse voltage v rwm 300 400 v maximum rms voltage v rms 210 280 v maximum dc blocking voltage v dc 300 400 v maximum average forward rectified current at t c = 100? i f(av) 8.0 a peak forward surge current 8.3ms single half sine-wave superimposed i fsm 110 a on rated load (jedec method) at t c = 100? operating junction and storage temperature range t j , t stg ?0 to +150 ? rms isolation voltage (ugf & byv29f types only) 4500 (1) from terminals to heatsink with t = 1.0 second, rh 30% v isol 3500 (2) v 1500 (3) electrical characteristics (t c = 25? unless otherwise noted) ug8ft ug8gt parameter symbol byv29-300 byv29-400 unit maximum instantaneous forward voltage (4) i f = 8a, t j = 25? v f 1.25 v i f = 8a, t j = 150? 1.03 i f = 20a, t j = 25? 1.40 maximum dc reverse current at v rrm t c = 25? 10 t c = 100? i r 350 a maximum reverse recovery time at i f = 0.5a, i r = 1.0a, i rr = 0.25a t rr 35 ns maximum reverse recovery time at 50 i f = 1.0a, di/dt = 100a/ s, v r = 30v, i rr = 0.1 i rm t rr ns maximum reverse recovery current at i rm 5.5 i f = 10a, di/dt = 50a/ s, v r = 30v, t c = 100? a maximum recovered stored charged at q rr 55 i f = 2a, di/dt = 20a/ s, v r = 30v, i rr = 0.1 i rm nc thermal characteristics (t c = 25? unless otherwise noted) ug8 ugf8 ugb8 parameter symbol byv29 byv29f byv29b unit typical thermal resistance from junction to case r jc 2.5 5.5 2.5 ?/w notes: (1) clip mounting (on case), where lead does not overlap heatsink with 0.110 offset (2) clip mounting (on case), where leads do overlap heatsink (3) screw mounting with 4-40 screw, where washer diameter is 4.9 mm (0.19? (4) pulse test: 300 s pulse width, 1% duty cycle
0 25 50 75 100 125 150 1 100 10 fig. 2 ?maximum non-repetitive peak forward surge current peak forward surge current (a) number of cycles at 60 h z 0 6.0 8.0 10 12 0 25 50 75 100 125 150 175 fig. 1 ?maximum forward current derating curve average forward rectified current (a) case temperature ( c) 0.4 0.2 0.6 0.8 1.0 1.2 1.4 1.6 instantaneous forward voltage (v) 20 60 40 100 80 fig. 4 ?typical reverse leakage characteristics instantaneous reverse leakage current ( a) percent of rated peak reverse voltage (%) 4.0 2.0 resistive or inductive load 0.01 0.1 10 100 1 instantaneous forward current (a) t j = 25 c t j = 100 c t j = 125 c reverse voltage (v) junction capacitance (pf) 0.1 1 10 100 100 10 1 0.01 0.1 10 1 100 1,000 fig. 6 ?typical junction capacitance t j = 25 c f = 1.0 mh z vsig = 50mvp-p fig. 3 ?typical instantaneous forward characteristics t c = 100 c 8.3ms single half sine-wave (jedec method) t j = 25 c t j = 125 c t j = 100 c fig 5 ?reverse switching characteristics per leg 0 25 50 20 40 60 80 100 120 140 160 75 100 125 stored charge/reverse recovery time (nc/ns) di/dt = 150a/ s di/dt = 150a/ s di/dt = 100a/ s di/dt = 100a/ s di/dt = 20a/ s di/dt = 50a/ s di/dt = 20a/ s junction temperature ( c) t rr q rr ratings and characteristic curves (t a = 25 c unless otherwise noted) byv29, byv29f, byv29b, ug8gt, ugf8gt, ugb8gt series vishay semiconductors formerly general semiconductor document number 88557 www.vishay.com 03-jul-02 3
|
